Description
CNC Milling Polishing Engraving Machine
for iPhone Main Board Repair
LY IC cnc router
Mould 10 in 1
Introduction
Perfectly combined producs of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area
This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 4, 4S, 5, 5C and 5S. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing
Technical Parameters
Machine Dimensions: |
600X510X480mm |
Rack material: |
6061 and 6063 Hard aluminum alloy |
Engraving area: |
400X300mm |
Z-Axis Stroke: |
80mm, Engraving depth depends on the length of the tool edge |
Acceptable material thickness: |
≤80mm |
Rail type: |
Chromeplate shaft + Linear Bearings, Surface hardening 61HRC |
Type of screw: |
Ball screw 1605, Pitch 4mm |
Spindle motor: |
1.5KW water cooling spindle , 0-24000r/min |
Collet type: |
ER11,1/8"(3.175mm) Collet |
Stepper motor and drive: |
two-phase hybrid stepping motor 57BYGH56-4011YD, 8 segments drive. |
Maximum operating speed: |
4000mm/min (Engraving speed : 300-3000mm/min) |
Repeat positioning Accuracy: |
0.03mm |
Communication interface: |
Parallel port |
Software Compatability: |
English |
Command code: |
G code/.nc/.ncc/.tab/.txt |
Machine weight: |
55kg |
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